What are three factors on which the amount of copper deposited will depend?

1. Current density: The amount of copper deposited will depend on the current density used during the electroplating process. Higher current densities will result in a faster deposition rate and a thicker layer of copper.

2. Time: The amount of copper deposited will also depend on the duration of the electroplating process. Longer plating times will result in a thicker layer of copper being deposited on the substrate.

3. Concentration of copper ions in the electrolyte: The amount of copper deposited will also depend on the concentration of copper ions in the electrolyte solution. Higher concentrations of copper ions will result in a faster deposition rate and a thicker layer of copper being deposited.

1. Current
2. Time
3. Concentration of copper ions